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Micro LED Display with Megapixel HELIOS LED Processing Platform

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Micro LED Display with Megapixel HELIOS LED Processing Platform

Micro LED Display with
Megapixel HELIOS LED Processing Platform

A man is giving a presentation in front of a large LED screen. The screen displays automobile-related content with clear visibility. A man is giving a presentation in front of a large LED screen. The screen displays automobile-related content with clear visibility.
* All images in this page are for illustrative purposes only.

Powerful UI/UX with
Megapixel HELIOS LED Processing Platform

With the Megapixel HELIOS LED Processing Platform, LSAP now has the capability to utilize powerful UX and UI functionalities. Real-Time Mapping and Multi-User Control, Superior Color Control, Hyper-Speed Seam Correction using a game controller, and Monitoring and Diagnostics through connected diagnostics are all available.
The MVR controller provides access to the features such as Real-Time Mapping and Multi-Use Control, Superior Color Control, Hyper-speed Seam Correction using a Game Controller, and Monitoring and Diagnostics using Connected Diagnostics. The MVR controller provides access to the features such as Real-Time Mapping and Multi-Use Control, Superior Color Control, Hyper-speed Seam Correction using a Game Controller, and Monitoring and Diagnostics using Connected Diagnostics.
* Megapixel HELIOS LED Processing Platform needs to be purchased separately

Enhanced Uniformity with
LST (LG Surface Treatment) Technology

LG MAGNIT's innovative Chip Transfer and Surface Treatment Technology enhances white uniformity and reduces color distortion from any angle, delivering true and accurate wide-angle viewing experiences. This technology ensures remarkable color uniformity, resulting in superior image quality.
While conventional screens distort colors (appearing red) at different angles, MAGNIT displays accurate results from every viewing angle. While conventional screens distort colors (appearing red) at different angles, MAGNIT displays accurate results from every viewing angle.

Achieving True Black with
Direct Chip Mounting

LG MAGNIT's advanced and precise method for direct bonding micro-sized chips onto circuit boards combined with the black coating technology, creates a stunning black expression that stands out compared to SMD-type LED displays. This makes it the ideal choice for displaying content that requires deep black color, ensuring that every image is rich, vibrant, and true to life.
Traditional SMD-type LEDs have larger chips, and the casing color used for the LED chips gives the screen an overall gray appearance. In contrast, Micro LEDs directly embed micro-sized chips on the substrate, with the non-chip areas being black, resulting in better representation of black color. Traditional SMD-type LEDs have larger chips, and the casing color used for the LED chips gives the screen an overall gray appearance. In contrast, Micro LEDs directly embed micro-sized chips on the substrate, with the non-chip areas being black, resulting in better representation of black color.
* Based on comparison against LG's conventional LED Signage

Accurate Colors as Intended

By carefully selecting an LED chip which is a key factor to determine color purity, its narrowed wavelength allows LG MAGNIT to show uniform colors across the screen. Furthermore, the enhanced Gamut Transfer technology supports it to describe colors close to the original color, which is essential for places where exact color representation is demanding.
The Ferris wheel shines brightly with vibrant colors. The Ferris wheel shines brightly with vibrant colors.

Care Less with Sturdy Design

Through several layers of coated film, LSAP can protect its LED chips from risks caused by water drops, dust, static electricity or physical impacts. It also meets the fire regulations with BS 476 Part 7 Class 1 certification. Considering that it is usually installed in public places where many people come and go, its stability is vitally important to minimize unforeseen accidents.
LSAP offers protection for LED chips from various factors like water drops, dust, static electricity, or physical impacts. Additionally, it has received BS 476 Part 7 Class 1 fire certification. LSAP offers protection for LED chips from various factors like water drops, dust, static electricity, or physical impacts. Additionally, it has received BS 476 Part 7 Class 1 fire certification.
* Based on in-house testing in accordance with the certification criteria, or under actual operating conditions.
PHYSICAL PARAMETERS
  • Pixel Configuration
    COB
    Pixel Pitch (mm)
    0.938
  • Module Resolution (W x H)
    320 x 120
    Module Dimensions (W x H, mm)
    300 x 112.5
  • Weight per Module (kg)
    0.19
    No. of Modules per Cabinet (W × H)
    2 × 3
  • Cabinet Resolution (W × H)
    640 × 360
    Cabinet Dimensions (W x H x D, mm)
    600x337.5x44.9
  • Cabinet Surface Area (m²)
    0.203
    Weight per Cabinet (kg/unit)
    7.6
  • Weight per Square Meter (kg/m²)
    37.5
    Physical Pixel Density (pixels/m²)
    1,137,778
  • Flatness of Cabinet (mm)
    ±0.5
    Cabinet Material
    Die-casting Aluminum
  • Service access
    Front and Rear
OPTICAL SPECIFICATIONS
  • Max Brightness (After Calibration, nit)
    Max. 600
    Color Temperature (K)
    6,504K / 2,000~10,000K
  • Visual Viewing Angle (Horizontal)
    160°
    Visual Viewing Angle (Vertical)
    160°
  • Brightness Uniformity
    ≥ 95%
    Color Uniformity
    ±0.02Cx,Cy
  • Contrast Ratio
    Max. 100,000:1
    Processing Depth (bit)
    22bit Internal processing (HDR10)
ELECTRICAL SPECIFICATIONS
  • Power Consumption (W/Cabinet, Max.)
    68
    Power Consumption (W/Cabinet, Avg.)
    47
  • Power Consumption (W/m², Max.)
    336
    Heat Dissipation (BTU/h/Cabinet, Max.)
    232
  • Heat Dissipation (BTU/h/Cabinet, Avg.)
    160
    Heat Dissipation (BTU/h/m², Max.)
    1146
  • Power Supply (V)
    100 to 240
    Frame Rate (Hz)
    23.98/24/25/29.97/30/50/59.94/60
  • Refresh Rate (Hz)
    3,840
OPERATION SPECIFICATIONS
  • LED Lifetime (Half brightness)
    100,000
    Operating Temperature(℃)
    0∘ to +40∘
  • Operating Humidity
    10-80%RH
    IP rating Front
    IP50
  • IP rating Rear
    IP20
CERTIFICATION
  • Certification
    IEC 62368-1
    EMC Class A,
    , BS476 Part7 Class2Y
Environment
  • Environment
    RoHS/REACH
CONTROLLER
  • Controller
    MVR HEIOS
SERIES
  • Series
    LSAP

To access more technical documentation and downloads, please visit the LG B2B Partner Portal.

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